مولد الصور الذكاء الاصطناعي
v1
Modern FPGA chip, futuristic circuit board, intricate pathways, gold wiring, silver connectors, sleek black casing, high-performance processing units, advanced memory blocks, complex logic gates, programmable fabric, reconfigurable architecture, 3D stacked silicon, nanoscale transistors, advanced packaging technology, microscopic details, shallow depth of field, bright LED indicators, subtle gradient background, futuristic laboratory setting, close-up shot, macro photography, high-key lighting.
الأسلوب:
توضيح-الأسود والأبيض 35