Top-down, system-level, high-performance, digital circuit, complex architecture, CPU-GPU-NPU, multi-layer, 3D structure, metallic interconnects, nanoscale transistors, thermal management, power consumption, clock speed, frequency analysis, signal processing, data transmission, bus architecture, cache memory, registers, ALU, FPU, pipelining, superscalar, out-of-order execution, branch prediction, speculative execution, performance counters, event-based sampling, statistical profiling, microarchitecture, RTL design, synthesis, place-and-route, backend compiler, software-hardware co-design, system-on-chip, real-time processing, low-power design, thermal-aware design, 3/4 composition, close-up shot, metallic material, futuristic ambient lighting.