Advanced multi-core system-on-chip architecture, futuristic motherboard, intricate circuitry, copper wires, microchips, silver heat sinks, sleek metal casing, LED indicator lights, high-speed data transmission lines, complex on-chip network design, 3D stacked architecture, mesh topology, router nodes, network interface, packet transmission, latency optimization, high-bandwidth interconnects, chiplet design, modular architecture, floorplan exploration, detailed metallic textures, futuristic ambient lighting, cinematic composition, wide-angle lens, depth of field.